How to reduce PCB circuit board production bending?

PCB circuit boards are an indispensable part of electronic products, and during the production process of PCB circuit boards, due to the influence of materials, processes and other factors, bending may occur. A bent PCB is not only aesthetically pleasing, it may also affect the performance and reliability of the board. Therefore, reducing PCB circuit board production bending is an important link in the PCB circuit board manufacturing process. This article will introduce how to reduce PCB circuit board production warpage.

1. Reasonable selection of materials

The material of the PCB circuit board has a great influence on its bending performance. Therefore, when selecting PCB circuit board materials, materials with better bending properties should be selected. Common PCB circuit board materials currently on the market include FR-4, CEM-1, CEM-3, etc. Among them, CEM-3 material has better bending performance, which can effectively reduce the bending of PCB circuit boards.

2. Control sheet thickness

The thickness of the PCB circuit board also affects its bending performance. Generally speaking, the greater the thickness of the PCB circuit board, the worse its bending performance. Therefore, when designing the PCB circuit board, the thickness of the plate should be controlled as much as possible to reduce the bending of the PCB circuit board.

3. Control panel size

The size of the PCB circuit board also affects its bending performance. Generally speaking, the larger the size of the PCB circuit board, the worse its bending performance. Therefore, when designing the PCB circuit board, the size of the board should be controlled as much as possible to reduce the bending of the PCB circuit board.

4. Control the number of layers of the board

The number of layers of a PCB circuit board also affects its bending performance. Generally speaking, the more layers of a PCB circuit board, the worse its bending performance. Therefore, when designing the PCB circuit board, the number of layers of the board should be controlled as much as possible to reduce the bending of the PCB circuit board.

5. Control the manufacturing process

The manufacturing process of the PCB circuit board will also affect its bending performance. Therefore, in the PCB circuit board manufacturing process, reasonable process control should be adopted to reduce the bending of the PCB circuit board. For example, in the process of PCB circuit board manufacturing, the temperature and humidity of the board should be controlled to prevent the board from being damp or over-dried, which will affect the bending performance of the PCB circuit board.

In short, reducing PCB circuit board production bending is an important link in the PCB circuit board manufacturing process. In the process of PCB circuit board design and manufacturing, materials should be reasonably selected, plate thickness, size and number of layers should be controlled, and reasonable manufacturing processes should be adopted to reduce the bending of PCB circuit boards.

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