12 Layers BGA PCB Board For Medical Electronics
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Layer： |
12 Layer |
|
Material： |
Fr-4 |
|
PCB Thickness： |
1.6mm |
|
Cu Thickness： |
2.0 OZ |
|
Min Line W/S： |
0.075/0.075mm |
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Surface Finish： |
Immersion gold |
|
Certificate： |
UL/ISO/TS16949 |
|
Application： |
Medical Electronics |
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Product Parameters
Item | Specifica |
Layers | 1~32 |
Board thickness | 0.1mm-7.0mm |
Material | FR-4，CEM-1/CEM-3，PI，High Tg，Rogers |
Max panel size | 32"×48"(800mm×1200mm) |
Min hole size | 0.075mm |
Min line width | 3mil(0.075mm) |
Surface finish | OSP，HASL，Imm Gold/Nickel/Ag， Electric gold |
Copper thickness | 0.5-7.0OZ |
Soldermask | Green/Yellow/Black/White/Red/Blue |
Silkscreen | Red/Yellow/Black/White |
Min PAD | 5mil(0.13mm) |
Inter package | Vacuum |
Outer package | Carton |
Outline tolerance | ±0.75mm |
Hole tolerance | PTH：±0.05 NPTH：±0.025 |
Certificate | UL，ISO 9001，ISO14001，IATF16949 |
Special request | Blind hole+Gold finger + BGA |
Material Suppilers | Shengyi, KB, Nanya, ITEQ,etc. |
General Introduction of BGA PCB
BGA stands for "Ball Grid Array," and PCB stands for "Printed Circuit Board." A BGA PCB is a type of circuit board that uses ball grid array technology for the attachment of integrated circuits (ICs) and other components.
In a BGA PCB, the ICs are mounted on the surface of the board, and the electrical connections are made by tiny balls of solder that are attached to the bottom of the ICs. These balls are then placed onto a grid of pads on the surface of the PCB, and the solder is melted to create a strong, permanent connection.
BGA PCBs are commonly used in electronic devices that require high-density circuitry, such as mobile phones, laptops, and other compact electronic devices. The use of BGA technology allows for more efficient use of board space, improved heat dissipation, and higher reliability compared to traditional through-hole or surface-mount component technologies.
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